Technical Support
Feedback
What are the common automotive-grade SiC-based IGBT module package types? Econodual series half-bridge packages are mainly used in commercial vehicles, with main specifications such as 1200V/450A and 1200V/600A; HP1 full-bridge packages are mainly used in low- and medium-power models, including some A-class cars and most A0 and A00 cars, with peak power generally within 70kW, mainly in the 650V400A model, and other specifications such as 750V300A, 750V400A, and 750V550A; HPD full-bridge packages are used in medium- and high-power models, mostly A-class cars and above, with the 750V820A specification occupying the mainstream market, and other specifications such as 750V550A; DC6 full-bridge packages are based on an integrated UVW three-phase full-bridge package solution, featuring compact packaging, high power density, and good heat dissipation performance; TO247 single-tube parallel connection: a small number of electronic control system solutions using TO247 single-tube packages also exist on the market. The advantages of using a single-tube parallel solution are mainly twofold: ① The single-tube solution enables flexible circuit design; simply connect in parallel as many single tubes as needed for the required current, so there is also a certain cost advantage; ② Parasitic inductance issues are easier to solve than with IGBT modules. However, using single-tube parallel connection also has some difficulties to be solved: ① Current sharing and balancing among each parallel single tube are relatively difficult, and consistency is difficult to guarantee, for example, achieving simultaneous switching, the same current, and the same temperature; ② The customer's system design and process are extremely difficult; ③ There are many interfaces, which places high demands on the production line. What test verification is required for automotive IGBT modules? Automotive IGBT modules have significantly higher requirements for product performance and quality than those in the consumer and industrial control fields, so automotive-grade certification has become the most important barrier in the automotive IGBT module market. Generally, automotive-grade IGBTs require a model introduction cycle of about 2 years. Automotive IGBT module test standards mainly refer to AEC-Q101 and AQG-324, and automakers will also put forward corresponding requirements according to their own model characteristics. The main test methods include: parameter testing, ESD testing, insulation withstand voltage, mechanical vibration, mechanical shock, high-temperature aging, low-temperature aging, temperature cycling, thermal shock, UHAST (unbiased highly accelerated temperature and humidity stress test), HTRB (high-temperature reverse bias), HTGB (high-temperature gate bias), H3TRB/HAST (highly accelerated temperature and humidity stress test with bias), power cycling, and solderability. Among them, power cycling and temperature cycling, as representative durability tests, have extremely strict requirements; for example, the number of power cycles may range from tens of thousands to hundreds of thousands. The main purpose is to test the durability of mechanical connection layers such as bond wires and solder layers. The failure mechanism during testing is mainly that the coefficients of thermal expansion of the chip, bond wires, DBC, solder, etc. are inconsistent, leading to bond wire lift-off and breakage, chip solder layer separation, and solder aging.
Quick Contact>
