Apollowave α-300 Apollo Microwave Manual 8-inch Probe Station

1 Probe station main unit: α-300

   1.1 Application:      Wafers or chips of 12 inches and below

    1.2   X-axis:     Coarse adjustment travel:310mm

            Coarse adjustment: self-locking push-pull rod

            Fine adjustment travel:25mm

            Fine adjustment: micrometer-controlled

            Control resolution:10 µm

1.3   Y-axis:    Coarse travel:340 mm

            Coarse adjustment: self-locking push-pull rod

            Fine travel:25 mm

            Fine adjustment: micrometer-controlled

            Control resolution:10um

1.4   Z axis:    Travel:10mm

            Coarse adjustment travel:5mm, accuracy: ±10%and below

            Fine adjustment travel:0.3mm, accuracy: ±20%and below

1.5   θ axis:    Travel: ±8° or above

1.6   Parallelism:  within 30 µm relative to the stage 

1.7   Dimensions:    600(W)×600(D)×450(H), excluding protrusions

1.8   Weight:    approx.60 kg

1.9   Vacuum pressure:    below-65 kPa(for wafer chucking)

1.10 Compressed air: 0.4–0.5 MPa

1.11 Operating environment: temperature 23 ℃±5℃, humidity 20%–80% (non-condensing)

1 probe station main unit: α-300

   1.1 Applicable:      12inch and below wafers or chips

    1.2   X axis:     Coarse adjustment travel:310mm

            Coarse adjustment: self-locking push-pull rod

            Fine adjustment travel:25mm

            Fine adjustment: micrometer control

            Control resolution:10um

1.3   Y-axis:    Coarse adjustment travel:340mm

            Coarse adjustment: self-locking push-pull rod

            Fine adjustment travel:25mm

            Fine adjustment: micrometer control

            Control resolution:10um

1.4   Z axis:    Travel:10mm

            Coarse adjustment travel:5mm, accuracy: ±10%and below

            Fine adjustment travel:0.3mm, accuracy: ±20%and below

1.5   θ axis:    Travel: ±8° or above

1.6   Parallelism:  to stage 30umand below

1.7   Dimensions:    600（W）×600（D）×450（H) excluding protrusions

1.8   Weight:    约60kg

1.9   Vacuum pressure    less than-65kPa(for wafer chucking)

1.10  Compressed air:0.4-0.5MPa

1.11  Operating environment: temperature23℃±5℃, humidity20%-80%(no frost)

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