Opsens Solutions Fiber Optic Sensors for Various Power Electronics Applications – with Paper List

Published: 2025-10-22 Views: 次

Here’s a list of different applications related to power electronics using Opsens Solutions fiber optic sensors.

Most of those papers and articles have been presented at conferences and symposium such as PCIM and APEC.

Here is a list of various power electronics applications using Opsens Solutions fiber optic sensors.

Most of these papers and articles were presented at conferences and symposia such as PCIM and APEC.

1. Experimental validation of a thermal modeling method dedicated to multichip power modules under working conditions

2. Ageing and failure modes of IGBT modules in high-temperature power cycling

3. Modeling and characterization of frequency-domain thermal impedance for IGBT modules based on heat flow information

4. Power cycling issues and challenges of SiC-MOSFET power modules at high temperatures

5. Effect of power cycling tests on traps under the gate of Al2O3/AlGaN/GaN normally-ON devices

6. Aging precursors and degradation effects of SiC MOSFET modules under highly accelerated power cycling conditions

7. Study of current density influence on bond wire degradation rate in SiC MOSFET modules

8. Implementation of direct chip junction temperature measurement in high-power IGBT modules in operation — railway traction converter

9. Thermal mapping of power semiconductors in H-bridge circuits

10. New electro-thermal model for a multichip power module used in motor drives

11. Load-dependent active thermal control of grid-forming converters

12. Thermal impedance measurement utilizing optical measurement and thermal impedance model for multichip SiC MOSFET modules with anti-parallel diodes

13. Modeling and correlation of two thermal paths in frequency-domain thermal impedance models of power modules

14. Active thermal management for a single-phase H-bridge inverter employing switching frequency control

15. Frequency-domain thermal modeling and characterization of power semiconductor devices

16. Thermal stress analysis and MPPT optimization of photovoltaic systems

17. Active thermal control of isolated soft-switching DC/DC converters

18. Active thermal control of GaN-based DC/DC converters

19. Analysis of DC-link current influence on capacitor temperature variation in a wind turbine application

20. Lifetime-based power routing in parallel converters for smart transformer applications

21. Thermally compensated discontinuous modulation for MVAC/LVDC building blocks of modular smart transformers

22. Study of current density influence on bond wire degradation rate in SiC MOSFET modules

23. Comparison of stress distributions and failure modes during thermal cycling and power cycling on high-power IGBT modules

    
    

Original links are as follows:

Experimental Validation of a Thermal Modelling Method dedicated to Multichip Power Modules under Working Conditions

Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling

Modeling and Characterization of Frequency-Domain Thermal Impedance for IGBT Module Through Heat Flow Information

Power cycling issues and challenges of SiC-MOSFET power modules in high temperature conditions

Effect of power cycling tests on traps under the gate of Al2O3/AlGaN/GaN normally-ON devices

Aging Precursors and Degradation Effects of SiC MOSFET Modules Under Highly Accelerated Power Cycling Conditions

Study of Current Density Influence on Bond Wire Degradation Rate in SiC MOSFET Modules

Implementation of direct Chip junction temperature measurement in high power IGBT module in operation — Railway traction converter

Thermal Mapping of Power Semiconductors in H-Bridge Circuit

New Electro-Thermal Model for a Multichip Power Module Used in a Motor Drive

Load-Dependent Active Thermal Control of Grid-Forming Converters

Thermal Impedance Measurement Utilizing Optical Measurement and Thermal Impedance Model for Multichip SiC MOSFET Module with Anti-Parallel Diodes

Modelling and Correlation of Two Thermal Paths in Frequency-domain Thermal Impedance Model of Power Module

Active thermal management for a single-phase H-bridge inverter employing switching frequency control

Frequency-Domain Thermal Modelling and Characterization of Power Semiconductor Devices

Thermal Stress Analysis and MPPT Optimization of Photovoltaic Systems

Active Thermal Control of Isolated Soft Switching DC/DC Converters

Active Thermal Control of GaN-Based DC/DC Converter

Analysis of DC-Link Current Influence on Temperature Variation of Capacitor in a Wind Turbine Application

Lifetime-Based Power Routing in Parallel Converters for Smart Transformer Application

Thermally Compensated Discontinuous Modulation for MVAC/LVDC Building Blocks of Modular Smart Transformers

Study of Current Density Influence on Bond Wire Degradation Rate in SiC MOSFET Modules

Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules