Cascade Summit200 FormFactor Fully/Semi-Automatic Probe Station

SUMMIT200 Overview

The new Cascade Summit200 advanced 200 mm probe station is essential for collecting high-precision measurement data quickly, whether from a single wafer or a high-volume batch.

This next-generation probe station features PureLineTM technology, delivering the lowest-noise measurement solution available on the market today. Patented AttoGuard® and MicroChamber® technologies significantly improve accuracy in low-leakage and small-capacitance testing. A new fast 200 mm loader with 50-wafer capacity provides high throughput, while the wide -60°C to 300°C temperature range gives scientists, R&D staff, test engineers and production operators everything they need to get the job done fast.

With its broad application coverage and upgrade path to meet any future requirement, the SUMMIT200 delivers the most advanced 200 mm probe station platform for fast, highly accurate, high-volume measurement of today's and tomorrow's devices and ICs.The SUMMIT200 platform is also available in different versions for measurement tasks that do not require the enhanced feature set described above. See the product brochure for details and options.

Measurement Accuracy

• High precision with PureLine, AutoGuard and next-generation MicroChamber technology The optimal solution for IV/CV,low-noise and 1/f measurements

• Minimizes AC and spectral noise through effective shielding

• Unrivaled RF/mmWave measurement and calibration accuracy with integrated RF tools and WinCal 

• Shortest signal path test integration for accurate, thermally stable and low-error data acquisition

• Productivity

• Up to 5x faster time to accurate data

• Advanced 200 mm stage for higher test throughput

• High-throughput UT/MT (multi-temperature unattended testing) with VueTrack™ and high-temperature stability (HTS) technology

• Automated wafer handling with optional loader

• Faster first data on standard and "hard-to-test" devices such as thin wafers, small pads and high-power devices

• eVue digital imaging systemwith enhanced optical visualization, fast setup, and on-die and wafer navigation

• Powerful automation tools cut total test time for wafers, singulated die and modules

• Positioning accuracy

• Advanced 4-axis semi-automatic stage for precise positioning and repeatable probe-to-pad contact

• Precise sub-micron positioning and active thermal compensation using motorized positioners and VueTrack PRO

• Additional fast "hands-on" wafer positioning via ergonomic manual control

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