Vamtek SiC/GaN-QDPAK, TOLL Package Semiconductor Curve Tracer Test Socket

The CX series test sockets enable accurate evaluationTO-3P andTO-247 The performance of packaged power devices is critical to development and manufacturing. Our test sockets provide innovative technology and high reliability to maximize accurate evaluation of MOSFET performance built with next-generation semiconductor materials such as SiC (silicon carbide) and GaN (gallium nitride). Our CX series sockets are designed forSemiconductor static parameters、Dynamic switching parameters, as well asDevice HTRB reliability testingdesigned to maintain stable electrical and mechanical integrity even under harsh conditions.

● Through-hole packages: fully compatible with classic packages such as TO-247-3, TO-247-4L, and TO-3P, meeting the testing needs of traditional power devices.

● SMD surface mount: fully supportedTOLL、TOLG、QDPAK、HU3PAK、TO-252and other new surface-mount packages, supporting high-density integrated designs.

1. Good compatibility: compatible with IWATSU CS3000/5000/8000 series and KEYSIGHT B1500/1505/1506 series semiconductor parameter analyzers

2. The test socket uses Kelvin connections to isolate the current path from the voltage measurement path, eliminating the effects of wiring and contact resistance on measurements and ensuring high-precision measurement.

3. Resistant to high and low temperatures (-55 to 220°C) with minimal impact on the test socket itself, maintaining stable mechanical and electrical characteristics even under harsh conditions, making it suitable for reliability testing and more.

4. Low parasitic inductance and low Ls, providing stable data and less interference for dynamic switching characteristic testing.

5. Low internal resistance, resulting in lower noise and smaller leakage current during static testing, ensuring more precise measurement. (Accurate SiC RdsON measurement.)

6. Low-outgassing materials are more suitable for cleanroom use with low contamination.

7. Wide package compatibility, supporting various DIP and SMD packages and various SiC and GaN packages.

8. Withstands high current and high voltage, supporting maximum DC 50 A current, DC 2500 V (1 min, 25°C), and maximum DC 5000 V

9. Customizable or co-developable with customers

For selection, please refer to the documents on the resource download page or contact us by phone