PHS-100S Single-Channel SiC/GaN Device Tj Simulation and High-Temperature Short-Circuit Failure Analysis System

Model：PHS-100S Country of Origin：China

Category：Device junction temperature simulator Tj

Overview：

The PHS-100S compact power semiconductor thermal test system is aminiaturized,high-precision, fanlesstemperature control system purpose-built for static parameter, dynamic characteristic, and reliability testing of power semiconductors (IGBT, SiC, GaN). It features low-voltage power supply, a patented structure, and effective high-temperature protection to ensure the safety of both devices and personnel.

Features

Specifications

Application Notes

Functions & Configuration

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The PHS-100 series high-stability temperature control system is a professional-grade junction temperature control adapter device for power devices independently developed by Jiechuang Instruments, consisting of THF series multi-type package fixtures, TCU multi-channel temperature control units, and EasyCon host computer software.

The PHS-100 offers industry-leading high stability with temperature control accuracy better than ±0.2°C. The unit adopts standard signal interfaces and supports multi-channel expansion and multiple package compatibility. It is mainly aimed at advanced packaged power devices and modules such as SiC and GaN, providing an accurate high-temperature junction temperature simulation environment. It is particularly suitable for static I-V parameter and dynamic double-pulse high-temperature and high-low temperature applications of power devices; through system expansion, it also supports thermal resistance analysis of devices and reliability analysis such as HTRB, HTGB, and H3TRB.

Key Features

・Temperature range: RT ~ 205°C

・Fanless temperature control, temperature control accuracy: ≤±1%±1°C

・Channels: 1 / 2 / up to 16 channels

- Designed specifically for discrete devices, double-pulse, and batch reliability testing

・Ultra-compact size, extremely space-saving for test benches

・Low-parasitic fixture that does not affect waveforms or measurement accuracy

Key Specifications

- Uniformity: ≤±1%±2℃

- Heating: 25→175℃ ≤ 500s

・Communication: Modbus-485

- Dimensions: 260×260×100mm

・Safety: over-temperature protection / over-current protection / emergency stop / insulated thermal design

Technical specifications

Parameter Category	Technical Specifications
Temperature range	25℃ (room temperature) to 200℃
Temperature Control Accuracy	±0.2℃ (steady state)
Thermal uniformity	≤±1℃ (within the load plane)
Heating Time	25℃→50℃: ≤50s
	25℃→125℃: ≤282s
	25℃→150℃: ≤489s
	25℃→175℃: ≤975s
Cool-down time	175℃→25℃: ≤25min
Power Input	AC 220V, 50Hz
Communication protocol	Modbus-485

Optional models:

PHS-100S : Single-channel junction temperature simulation system 25℃ (room temperature) to 200℃

PHS-100D ：双ChannelJunction temperature simulation system 25℃ (room temperature) to 200℃

PHS-100N : Custom multi-channelJunction temperature simulation system 25℃ (room temperature) to 200℃

Application directions:

1. Junction temperature simulation of MOSFET, BJT, IGBT devices in TO-247 packages.

2. Junction temperature simulation of new packages such as QDPAK, TOLL, TOLG, HU3PAK, TPAK, etc., or simulated devices.

3. High-temperature short-circuit failure experiments of power devices

4. Static high-temperature parameter shift experiments of power devices

5. Dynamic double-pulse parameter shift experiments of power devices

6. Thermal reliability verification such as HTRB, HTGB of power devices/chips

7. Verification of composite electrical and mechanical parameters under other highly stable temperature conditions (-55/205 degrees)

Model and function matrix

Product series	Complete Model	Channel configuration	Operating temperature range	Core Function Configuration	Core Application Scenarios
PHS-100 SeriesDevice-level compact multi-channelTemperature cycling testsystem	PHS-100S	Single Channel	Room temperature ~205℃	Standard temperature control unit, basic PC software, standard configuration TO-247 fixture	Junction temperature characterization of discrete devices, static, dynamicparameter temperature dependence research, single-device high-temperature aging testing
	PHS-100D	Dual Channel	Room temperature ~205℃	Dual ChannelTemperature control unit, basic PC software, standard TO-247 fixture	Half-bridge structure dual-device switching characteristics temperature变Test
	PHS-100N	Multi-channel (max 16CH）	Room temperature ~205℃	Multi-channel temperature control unit、Basic PC software, standard TO-247 fixture	Discrete device batch reliability verification, production line high-temperature consistency screening
PHS-200 SeriesProfessional-grade device / Module universal junction temperature simulation system	PHS-200S	Single-channel high power	Room temperature ~205℃	High-power temperature control unit, basic PC software, standard TO-247 fixture, optionalModule-levelHOT PLATE (max area 160×85mm )	Power module full temperature rangeTemperature-Electrical performanceCharacterization research, module-level static/DynamicParameter temperature characterization
	PHS-200D	Dual-channel high-power	Room temperature ~205℃	High powerDual ChannelTemperature control unit, basic PC software, standard TO-247 fixture, optionalModule-levelHOT PLATE (max area 160×85mm )	Power module full temperature rangeTemperature-Electrical performanceCharacterization research, module-level static/DynamicParameter temperature characterization
	PHS-200SP	Single Channel + Built-in SMU module	Room temperature ~205℃	StandardTemperature control unit 、 High precision SMU module, junction temperature calibration and analysisPC software, optional windless junction temperature test fixture	Device thermal resistance analysis, junction temperature calibration verification, package thermal characteristics research
	PHS-200DP	Dual Channel + Built-in SMU module	Room temperature ~205℃	StandardDual-channel temperature control unit 、 High precision SMU module, junction temperature calibration and analysisPC software, optional windless junction temperature test fixture	Device thermal resistance analysis, junction temperature calibration verification, package thermal characteristics research
PHS-500 SeriesExpert-level high/low temperature wide-range junction temperature simulation system	PHS-500S	Single-channel high/low temperature	-20℃~300℃	Wide temperature rangeTemperature controlunit, anti-condensation structure, basic high/low temperature control software, full temperature range temperature cycling programming	Package-level discrete device full temperature range junction temperature characterization, high/low temperature cycling simulation, device extreme temperature tolerance testing
	PHS-500P	Single-channel professional high/low temperature	-40℃~150℃	Ultra-wide temperature range junction temperature control unit, explosion-proof protection design, safety interlock, automotive test flow presets, full-condition dynamic junction temperature loading	Power module automotive-grade full temperature range certification, high/low temperature shock reliability testing,-40℃~150℃ automotive operating condition junction temperature simulation, device lifetime acceleration verification
	Custom model	Customizable channel count / Hot plate size / Function	Customizable temperature range	Non-standard hot plate design, explosion-proof / Thermal insulation customization, multi-channel expansion, special condition junction temperature flow development	Military / aerospace special condition simulation, customized junction temperature test requirements

Adapter fixture and clamp selection

Fixture Series	Compatible Package Types	Core technical features	Standard Model
THF-247 Series	TO-247-3/TO-247-4/TO-220/TO-252 through-hole package	Adjustable contact pressure, highly stable thermal conduction, optional adaptation for short-circuit reliability testingSC version	THF-247 (standard type) THF-247-P (enhanced thermal insulation type) THF-247-SC（Suitable for short-circuit testingtype)
THF-K10Series top-side cooling SMD Fixture	TO-263, TO-263-7, TOLT, HU3PAK, QD-PAK, R2PAK and other top-side cooling surface-mount packages	Full package compatibility, quick-install structure, high-insulation thermal interface, contact surface temperature uniformity≤±1%±1℃	THF-K10 (general type)
THF-TOLL Bottom-side cooling SMD Fixture	TOLL bottom-cooling surface-mount package	Multi-pin compatible contact, insulation withstand voltage 3kV, suitable for high-density test stations	THF-TOLL（customizedDedicated type)
THF-TOLG Series powerDeviceFixture	TOLG bottom-cooling surface-mount package	Multi-pin compatible contact, insulation withstand voltage 3kV, suitable for high-density test stations	THF-TOLG（customizedDedicated type)

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PHS-100S Single-Channel SiC/GaN Device Tj Simulation and High-Temperature Short-Circuit Failure Analysis System

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