PHS-200 Series Dual-Channel SiC-GaN Professional-Grade Device / Module Universal Fanless Junction Temperature Simulation System

Model：PHS-200 Country of Origin：China

Category：Device junction temperature simulator Tj

Overview：

The PHS-200 is a professional forced-air-free junction temperature simulation system that supports junction temperature control for both packaged power devices and packaged power modules. It can be paired with Iwatsu's CS series or Keysight's power device analyzers to form a power device analysis system, enabling one-click datasheet characterization testing of power devices.

Features

Specifications

Application Notes

Functions & Configuration

Key Features

・Temperature range:RT ~ 205℃

・Airless temperature control,Temperature control accuracy:≤±1%±1℃

・Supports discrete devices & dual-scenario adaptation for power modules

・Large heating plate to meet heating needs of full-spec modules

・OptionalJunction temperature measurementmodule, adopting JEDEC JESD51-1 standard temperature measurement methodachievesk-factor calibration andjunction temperaturecharacteristics underTest, meeting JESD47/IEC/AEC-Q101/AQG-324test requirements.

- Suitable for high-end R&D, module testing、Datasheet calibration

Key Specifications

•Temperature uniformity: ≤±1%±2℃

• Heat-up rate: 25→175℃ ≤ 720s(module example)

• Heating power: 300–500 W per channel

• Maximum heating area: 160×80mm

• Safety features: over-temperatureprotection/ over-currentprotection/ emergency stop / insulated thermal isolation/ safetyinterlock

Parameter	Test conditions	PHS-100 Series	PHS-200 Series	PHS-500 Series
Operating temperature range	Rated load, ambient temperature 25℃	Room temperature ~205℃	Room temperature ~205℃	PHS-500S：-10℃~300℃ PHS-500P：-40℃~150℃
Steady-state temperature control accuracy	Constant temperature state, rated load	≤±1%±1℃	≤±1%±1℃	≤±1%±1℃
Load plane thermal uniformity	Constant temperature state, full power load	≤±1%±2℃	≤±1%±2℃	≤±1%±2℃
Temperature setting resolution	Full temperature range	0.1℃	0.1℃	0.1℃
Heating transient characteristics	Ambient temperature 25℃, no load	25℃→50℃：≤50s；25℃→125℃：≤290s；25℃→175℃：≤975s	25℃→175℃：≤800s	Room temperature→175℃：≤600s； 150℃→-40℃：≤60min； Room temperature→-40℃：≤15min
Temperature cycle consistency	100 cycles, rated load	≤±1%±0.3℃	≤±1%±0.3℃	≤±1%±0.5℃
Long-term constant-temperature stability	1000h continuous operation, rated load	≤±1%±0.5℃	≤±1%±0.5℃	≤±1%±0.8℃

Full temperature range of power modulestemperature-electrical performancecharacteristics research

Module-level static/dynamicparameter temperature characterization

Device thermal resistance characteristics analysis

Junction temperature calibration verification

Package thermal characteristics research

PHS-200 SeriesProfessional-grade device / Module universal junction temperature simulation system	PHS-200S	Single-channel high power	Room temperature ~205℃	High-power temperature control unit, basic PC software, standard TO-247 fixture, optionalModule-levelHOT PLATE (max area 160×85mm )	Power module full temperature rangeTemperature-Electrical performanceCharacterization research, module-level static/DynamicParameter temperature characterization
	PHS-200D	Dual-channel high-power	Room temperature ~205℃	High powerDual ChannelTemperature control unit, basic PC software, standard TO-247 fixture, optionalModule-levelHOT PLATE (max area 160×85mm )	Power module full temperature rangeTemperature-Electrical performanceCharacterization research, module-level static/DynamicParameter temperature characterization
	PHS-200SP	Single Channel + Built-in SMU module	Room temperature ~205℃	StandardTemperature control unit 、 High precision SMU module, junction temperature calibration and analysisPC software, optional windless junction temperature test fixture	Device thermal resistance analysis, junction temperature calibration verification, package thermal characteristics research
	PHS-200DP	Dual Channel + Built-in SMU module	Room temperature ~205℃	StandardDual-channel temperature control unit 、 High precision SMU module, junction temperature calibration and analysisPC software, optional windless junction temperature test fixture	Device thermal resistance analysis, junction temperature calibration verification, package thermal characteristics research

Adapter fixture and clamp selection

Fixture Series	Compatible Package Types	Core technical features	Standard Model
THF-247 Series	TO-247-3/TO-247-4/TO-220/TO-252 through-hole package	Adjustable contact pressure, highly stable thermal conduction, optional adaptation for short-circuit reliability testingSC version	THF-247 (standard type) THF-247-P (enhanced thermal insulation type) THF-247-SC（Suitable for short-circuit testingtype)
THF-K10Series top-side cooling SMD Fixture	TO-263, TO-263-7, TOLT, HU3PAK, QD-PAK, R2PAK and other top-side cooling surface-mount packages	Full package compatibility, quick-install structure, high-insulation thermal interface, contact surface temperature uniformity≤±1%±1℃	THF-K10 (general type)
THF-TOLL Bottom-side cooling SMD Fixture	TOLL bottom-cooling surface-mount package	Multi-pin compatible contact, insulation withstand voltage 3kV, suitable for high-density test stations	THF-TOLL（customizedDedicated type)
THF-TOLG Series power device fixtures	TOLG bottom-cooling surface-mount package	Multi-pin compatible contact, insulation withstand voltage 3kV, suitable for high-density test stations	THF-TOLG（customizedDedicated type)
THF-M series power module fixtures	HPD, EasyPACK, T-PACK and other mainstream power module packages	Large-area uniform heating, load surface temperature uniformity≤±1%±1℃、Standard hot plate size:160*80mmCustomizable hot plate size	THF-M16X Series
CustomizationHOT PLATE	Non-standard power modules, specially packaged devices，4040mm, 6060mm, 8080mm, 100100mm up to max 300*300mm	Based on 3D model thermal simulation optimization, customized structural design, full temperature range thermal uniformity verification	THF-XXX custom series

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PHS-200 Series Dual-Channel SiC-GaN Professional-Grade Device / Module Universal Fanless Junction Temperature Simulation System

Key Features

Key Specifications

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