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Products
High-Temperature Chip Acceptability Test System WAT-200KA

High-Temperature Chip Acceptability Test System WAT-200KA

Model:WAT-200KA      Country of Origin:Japan

Category:WAT Wafer Acceptance Test System

Overview:

This system is purpose-built for wafer-level on-wafer I-V/C-V electrical characterization and reliability electrical testing of two- and three-terminal power devices on wafers, including diodes, bipolar transistors, MOSFETs, IGBTs, and wide-bandgap power devices. It supports TAIKO-spec wafers and is backward compatible with conventional wafer and die testing. The system performs I-V/C-V characterization during MOSFET and IGBT power device fabrication, as well as on-wafer static characterization of IGBT/FRD chips.

Features
Specifications
Application Notes
Functions & Configuration

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This system is purpose-built for on-wafer electrical characterization and reliability electrical testing of two- and three-terminal power devices—diodes, transistors, MOSFETs, IGBTs, and wide-bandgap power devices—on TAIKO-spec wafers, with backward compatibility for standard wafers and die-level testing. It integrates interfaces to world-leading semiconductor test instruments: the Keithley 4200A-SCS parameter analyzer and APOLLOWAVE's industry-standard Alpha 200 manual probe station with high/low-temperature capability. Paired with the 4200A-SCS, the Alpha 200 enables I-V/C-V characterization during MOSFET and IGBT power device fabrication, as well as on-wafer static characterization of IGBT/FRD die.

The wafer contact assembly comprises the Alpha probe station, probes, and probe arms. The probe station requires no leveling adjustment and supports 8-inch TAIKO wafers, with backward compatibility for standard-spec wafers.

The system is equipped with a stage support and a safety interlock guard; during testing, the interlock switch signal is tied into the instrument interlock to protect both operators and devices.

Designed around ergonomic principles and industry best practices for on-wafer testing, the system incorporates multiple design innovations that effectively reduce the risk of accidental contact and misoperation, delivering superior performance, operational flexibility, and ease of use compared with conventional test benches.

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The WAT system can perform parameter analysis on four-terminal, three-terminal, and two-terminal structures of IGBTs, MOSFETs, diodes, transistors, resistive devices, capacitors and capacitive devices, and devices combining resistive and capacitive elements, including leakage current, conduction current, internal resistance, withstand voltage, junction capacitance, C-V characteristics and other electrical parameter measurements.

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Maximum operating voltage: 200V, expandable to 2000V

Minimum operating voltage: 0.2uV

Maximum operating current: 100A (pulse)

Minimum current resolution: 0.1fA

Maximum operating temperature: 300°C

Supported wafers: 4", 6", 8" 

Contact resistance: < 15mohm

TAIKO:   supports minimum 100um-300um

Supported device types: planar, vertical, 2-terminal, 3-terminal, 4-terminal devices


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